This inspection verifies the box damages, ESD protection, type of package, humidity indicator card (HIC) pass H2O test, etc. This testing is non-destructive and performed in accordance with SAE AS6081, 4.2.6.4.1.

This inspection verifies the characteristics of electronic parts to evaluate quality and originality. This includes inceptions such as the condition of the components, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is non-destructive and performed per SAE AS6081 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.

Common things generally looked for during a visual inspection test of an Integrated Circuit device include:

• Package condition and dimension of the product
• Device markings and signs of remarking
• Body inspection to identify scratches, cracks, corrosion, contamination, markings, coatings, etc.
• Pin indicator orientation, texture, coating, dimensions
• Lead condition (oxidation, alignment, exposure, corrosion, etc.)
• BGA inspection for broken, damaged or displaced BGA’s
• Substrate condition

Electronic Tests will verify electrical operating conditions of active and passive components on various types of components from limited DC function to full DC/AC function. This is performed in accordance with MIL-STD-883 and manufacturer’s specifications. We can simulate test conditions depending on industry compliance requirements (i.e., Military, Automotive, Medical, etc.).

Electrical testing is helpful to:

• evaluate input and output characteristics of electronic components
• compare known “good” devices with unknown devices to provide some level of examination
• detect failure analysis

The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. It determines if the electric component will have soldering issue at the contract manufacturer. This destructive test is performed per MIL-STD-883 Method 203.8 and J-STD-002.

Decapsulation tests can be provided for customers to ensure that the original manufacturer has produced the device. This destructive test will expose the die, and characteristics such as die markings, metallization damage due to ESD or corrosion will be verified. Decapsulation is usually performed on 1 sample per lot / date code base on MIL-STD-883, Method 2014 or AS6081, 4.2.6.4.6.

A decapsulation test exposes the internal structure of the device by removing the exterior of the device. This is often achieved using an acid mixture to expose the bonding wires, internal structure, and the die.

X-ray inspections are non-destructive tests to verify the bond wire connections, die size comparison and ESD damaged. X-Ray are performed base on AS6081 4.2.6.4.4 and MIL-STD-883 2012.7. Counterfeit devices can be determined by comparing the structure of the die to a known good device, while the test also analyses:

Electrical testing is helpful to:

• Broken or Missing Bond Wires
• Wire Bonding Options
• Void Analysis
• Check for De-lamination
• Structure Analysis
• Die Size Comparison